[News] Foxconn Invests €250M in Europe’s First Fan-Out Wafer Level Packaging Plant

According to Economic Daily News, Foxconn announced on May 19 a EUR 250 million investment in Europe. The plan includes forming a joint venture in France with Thales and Radiall to focus on advanced semiconductor packaging and testing (OSAT), along with a strategic partnership with Thales in the satellite sector.

As noted in Foxconn’s press release, the OSAT project will use fan-out wafer-level packaging (FOWLP) technology, making it Europe’s first advanced FOWLP packaging and testing facility. The plant will help Foxconn establish a local presence and bolster its global supply chain. Economic Daily News indicates that initial sales will focus on the European market, serving clients in automotive, aerospace, 6G communications, and defense.

Foxconn Expands Into Satellite Ecosystem With Strategic Partnerships

In the satellite sector, Economic Daily News notes that the partnership will combine Thales’ space technology expertise with Foxconn’s high-tech manufacturing capabilities. According to Foxconn’s press release, the goal is to jointly develop high-quality, high-value satellites for large-scale low Earth orbit (LEO) telecommunications constellations.

As Economic Daily News highlights, this marks a significant step in Foxconn’s push into the space industry, following the launch of its self-developed LEO PEARL CubeSat in November 2023.

Foxconn Group’s Head of B5G Strategy, Jesse Chao, previously stated that LEO satellites could play a key role in 5G or 6G networks over the next 10 to 15 years, as cited by Economic Daily News. The report also notes that Foxconn aims to provide contract manufacturing services in the satellite supply chain through a standardized, industrialized model.

To expand its role in the satellite supply chain, Foxconn and its subsidiaries have partnered with various firms. According to Economic Daily News, collaborations include a LEO user terminal developed by FIH and Sharp, an Earth observation camera module by Rayprus, and space-grade connectors and cables from FIT.

Meanwhile, Foxconn is actively expanding its electric vehicle business. Foxconn recently announced that its subsidiary, Foxtron Vehicle Technologies, has signed a memorandum of understanding (MOU) with Mitsubishi Motors Corporation. Under the agreement, Foxtron will handle design and manufacturing management, with the vehicle expected to launch in Australia and New Zealand in the second half of 2026.

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(Photo credit: Foxconn)