AI-driven semiconductor demand is reportedly fueling another round of price increases across the OSAT industry. According to MoneyDJ, citing industry sources, ASE, the world's leading outsourced semiconductor assembly and test (OSAT) provider, has raised its packaging quotes by more than 20%, driven...

The AI chip race is intensifying across the board, with advanced packaging growing in significance and driving a surge in OSAT capital spending. According to Commercial Times, Taiwan-based OSAT players ASE, Powertech, and King Yuan Electronics (KYEC) are expected to see their combined capital expend...

China’s packaging and testing industry is stepping up, with a surge in domestic investment fueling growth. According to ijiwei, from late 2025 to early 2026, leading A‑share OSAT companies have been particularly active, signaling a shift toward higher-end and more specialized capital spending. ...

According to Economic Daily News, Foxconn announced on May 19 a EUR 250 million investment in Europe. The plan includes forming a joint venture in France with Thales and Radiall to focus on advanced semiconductor packaging and testing (OSAT), along with a strategic partnership with Thales in the sat...

As the chip war heats up, the U.S. BIS unveiled an updated semiconductor whitelist on February 4, per its website. Commercial Times reports that the list, split into IC design (IW) and packaging & foundry (PW) categories, is likely to spark a shift in chip orders from China—a boost for Taiwan�...