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Following Xiaomi’s launch of its first in-house 3nm chip, XRING 01, Taiwanese smartphone chipmaker MediaTek also signals its first 2nm products at Computex 2025. According to Commercial Times, the company’s first 2nm chip is expected to tape out in September.
As MediaTek deepens its partnership with NVIDIA, Economic Daily News reports that its first 2nm chip, manufactured by TSMC, could be either a next-gen flagship smartphone SoC or a custom ASIC for NVIDIA’s NVLink Fusion system.
According to MediaTek’s press release, as one of the first adopters of NVIDIA NVLink Fusion, the company is leveraging its expertise in ASIC design and high-speed interconnects to create custom AI silicon that addresses the evolving needs of cloud-scale AI workloads. In addition to MediaTek, Marvell and Alchip are also among NVLink Fusion’s first adopters.
Smartphone SoCs Betting on Cutting-edge Nodes
Commercial Times, citing CEO Rick Tsai, suggests that MediaTek has shipped over 20 billion chips for end devices over the past decade, powering everything from smartphones to edge devices. Notably, Tsai also reveals that MediaTek, following the adoption of 2nm, will also leverage TSMC’s more cutting-edge nodes in the future, including A16 and A14, as per the report.
Building on the launch of its 3nm-based Dimensity 9400, MediaTek followed up this April with the Dimensity 9400+, reportedly manufactured using TSMC’s N3E process.
Xiaomi, both a rival and client of MediaTek, has confirmed that its latest in-house smartphone chip, the XRING 01, is also built on 3nm. Wccftech indicates that the chip is likely to be made on TSMC’s second-generation 3nm process as well.
Meanwhile, Qualcomm—another major MediaTek rival—is expected to adopt TSMC’s 2nm process to stay competitive with Apple’s A20 chip. Wccftech reports that its Snapdragon 8 Elite Gen 3, set for 2026, will likely be built on 2nm.
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(Photo credit: MediaTek)