According to a report from Nikkei News, US chip giant Intel will join forces with 14 Japanese companies to develop automation technology for "backend" semiconductor processes such as packaging. The aim is said to achieve automation by 2028, highlighting efforts by both the US and Japan to collaborat...

Japan is reportedly planning to expand export restrictions on four technologies related to semiconductors or quantum computing, as per a report from Bloomberg. This move is said to represent the latest initiative in global efforts to control the transfer of strategic technologies. The same report...

As the global semiconductor landscape undergoes restructuring, major packaging and testing companies are actively establishing overseas advanced packaging capacities. According to a report from Commercial Times, semiconductor industry sources have indicated that, in terms of the clustering effect wi...

Following TSMC's announcement of investing USD 20 billion to build two plants in Kumamoto, Japan, industry sources cited by a report from Commercial Times has indicated that the major global semiconductor assembly and testing provider, ASE Group, is in discussions with the Japanese government to fin...

Henri Richard, head of Rapidus Design Solutions, the US subsidiary of Japan's semiconductor foundry startup Rapidus, and former Chief Marketing Officer at processor giant AMD, indicates that Rapidus aims to position itself as a filler of market gaps during the interview with global media The Regis...