As memory makers push deeper into custom HBM logic dies for the HBM4 era, foundries—led by TSMC—are stepping up with more breakthroughs. German outlet HardwareLUXX reports that TSMC’s custom HBM4E, currently dubbed C-HBM4E, will leap to the N3P node. Along with dropping voltage from 0.8 V to 0...

As HBM4 heads toward mass production in 2026, industry players are beginning to look ahead to HBM4E as the next stage of development. According to Chosun Biz, citing industry sources, with HBM4E the market is expected to move beyond standardized, mass-produced products toward more customized solutio...

The HBM4 race is heating up. Shortly after Micron showcased its HBM4 progress, shipping customer samples with over 2.8 TB/s bandwidth and pin speeds above 11 Gbps, Samsung unveiled impressive HBM4e details at the 2025 OCP Global Summit. According to SeDaily and TweaksTown, Samsung’s HBM4e, sla...

With NVIDIA reportedly developing its own HBM base die for 2027 production, the spotlight is on memory giants moving base die manufacturing from DRAM to foundry processes. According to South Korea’s Digital Daily, Micron may take the most cautious approach, delaying the shift to foundries until HB...

As Samsung pushes to accelerate 1c DRAM development and regain ground in the HBM4 race, current leader SK hynix is pulling ahead with custom HBM solutions for tech giants. According to the Korea Economic Daily, its first customized HBM—likely HBM4E—is set to debut in the second half of 2026. ...