As memory giants gear up for the next-gen HBM battle, JEDEC has officially released the JESD270-4 HBM4 standard in mid-April. With AI models and HPC workloads demanding faster, larger memory, HBM4 is arriving just right on time. As per JEDEC’s press release, one of the major improvements in HBM...

With 1y and 1z nm 8Gb DDR4 production reportedly winding down, Samsung is said to be discontinuing its HBM2E products as well, as Commercial Times reveals they’ve reached the Last Buy Order (LBO) stage. Though Samsung declined to confirm the information, this could imply its shift to more high-...

Despite ongoing uncertainty surrounding Trump’s proposed tariffs, leading memory manufacturers are moving forward with HBM development. According to Chosun Biz, industry sources on the 16th indicate that Samsung’s 4nm logic dies have achieved a test production yield exceeding 40%. As these logic...

With SK hynix reportedly securing exclusive 12H HBM3E supply to NVIDIA’s GB300 AI chip, the South Korean memory giant has now come up with more good news. According to its press release, the company has shipped the world’s first 12-layer HBM4 samples to major customers. Leveraging its HBM exp...

Recently, SK Hynix announced the full-scale commencement of construction on the first wafer plant within its Yongin Semiconductor Cluster, with completion expected in May 2027. In July 2024, the SK Hynix board of directors approved an investment of approximately 9.4 trillion KRW (about $6.67 bill...