As SK hynix continues to advance next-generation memory, the company is also reportedly moving to build capabilities in cutting-edge packaging technologies. According to ZDNet, sources say SK hynix is preparing to set up its first 2.5D packaging mass-production line at a new U.S. packaging facility ...

As AI infrastructure ramps up, memory supply tightens and prices soar. Commercial Times, citing industry experts, projects that cloud high-speed memory consumption could reach 3 exabytes (EB) by 2026. Notably, when factoring in the "equivalent wafer usage" of high-speed memory like HBM and GDDR7, th...

As China’s top memory firms race to advance next-gen DRAM and NAND, domestic chip equipment makers are stepping up for a slice of the booming HBM market as well. According to ijiwei, ACM Research has introduced several solutions optimized for HBM production and plans to release HBM4-compatible cle...

Micron Technology has announced plans to invest JPY 1.5 trillion (approximately USD 9.6 billion) to build a new factory dedicated to high-bandwidth memory (HBM) chip production in Hiroshima, Japan. The facility will be located within Micron’s existing Hiroshima site, with construction scheduled to...

HBM4 isn’t even in mass production yet, but the industry is already sketching out HBM9. According to The Elec, Yang Jun-mo, a principal researcher at the Korea Nanofab Center (NNFC), predicts that HBM9—expected to debut around 2040—will deliver performance more than 60 times higher than sixth-...