Samsung, as per a report from the global media outlet wccftech, has decided to enter the next generation of packaging technology by commencing R&D works for the adoption of "Glass Substrate" by 2026. The report further indicates that Samsung's preparation to enter the glass substrate indus...

According to Taiwan's Business Next, as Moore's Law gradually reaches its limits, semiconductor manufacturers are transitioning from 2D to 3D chip stacking and packaging to increase transistor counts for improved performance. The final step, "packaging," has become crucial. In line with this trend, ...