Amid speculation that Intel may halt promotion of its 18A process to foundry customers, another initiative is reportedly under review. According to Wccftech, citing German outlet ComputerBase, industry sources suggest that Intel is considering abandoning its glass substrate efforts. As noted by C...

According to a report from Business Korea, citing SEDaily, Samsung Electronics’ Device Solutions (DS) division has begun developing “glass interposers,” a next-generation packaging material. The goal is not only to replace the expensive silicon interposers but also to enhance performance. M...

TSMC's fan-out (InFO) packaging process will no longer be exclusively used by Apple. According to a report from Commercial Times, it's revealed that Google's self-developed Tensor chips for their phones will switch to TSMC's 3nm process next year and will also start using InFO packaging. TSMC...

According to a previous report from Nikkei citing sources, TSMC is rumored to be entering the fan-out panel-level packaging sector. As cited in a report from UDN, Intel and Samsung have also announced plans to invest in this area. With TSMC, the leading wafer foundry, joining the fray, the three sem...

Samsung Electronics is ramping up its entry into the semiconductor glass substrate market by advancing its equipment procurement and installation to September, with trial production slated to begin in the fourth quarter, one quarter earlier than originally planned. According to a report from South K...