According to South Korean media outlet The Bell, Samsung Electronics and SK hynix are reportedly delaying the adoption of ASML’s high-NA EUV lithography equipment in their DRAM production, citing the steep cost of the tools and upcoming shifts in DRAM architecture. 3D DRAM Architecture Won’t ...

A surge in DRAM demand—fueled by stockpiling ahead of Trump’s tariffs—seems to be real. According to South Korea’s Etnews, Samsung has raised DRAM prices for the first time in over a year, with DDR4 seeing the sharpest jump. The report suggests that Samsung, finalized new pricing terms wi...

On May 7, NEO Semiconductor announced a major breakthrough in its 3D X-DRAM technology series: the industry’s first 3D X-DRAM cell structures based on 1T1C and 3T0C architectures. According to NEO Semiconductor, the new technology is designed to deliver unprecedented density, power efficiency, ...

According to TrendForce's latest memory spot price trend report, regarding DRAM, the three major DRAM suppliers have announced the impending end of production for DDR3 and DDR4 DRAM. This has triggered a rapid response in the spot market, with buyers busily stocking up on related memory products in ...

According to TrendForce's latest memory spot price trend report, regarding DRAM, OEMs are gradually increasing inventory levels to ensure they have safe amounts of stock on hand before tariff policies become clearer, while DRAM suppliers have simultaneously raised spot prices of DRAM products by 8-1...