Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, stated that 3D IC is a crucial method for integrating AI chip memory with logic chips. According to a report from TechNews, regarding the development of 2.5D CoWoS advanced packaging, which integrates eight chiplets, T...

With advanced packaging capacity at TSMC being tight, the expansion of CoWoS has garnered significant attention. According to a report from Economic Daily News, Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, noted at SEMICON Taiwan 2024 that the foundry giant is rapidl...

Amid the AI boom driving a surge in demand for advanced packaging, Samsung Electronics announced in March its ambition to achieve record-high revenue for the business this year, aiming to surpass the USD 100 million mark. The company, which is eager to catch up with TSMC not only on the foundry bu...

According to sources cited in a report from Commercial Times, in response to the global increase in chip orders and rapid AI development, TSMC is actively seeking available land to keep its most advanced process technologies in Taiwan. Currently, TSMC has already planned three 2nm fabs at the N...

According to a report from The Chosun Daily, major tech companies like NVIDIA are considering using Intel's foundry services (IFS) as an alternative due to TSMC's packaging capacity shortages. While packaging is a core competency for semiconductor foundries, Samsung, which is facing difficulties in ...