In the surge of AI advancements, a CoWoS expansion wave is rapidly underway, with TSMC showcasing ongoing ambitions in advanced packaging. According to MoneyDJ, recent industry reports suggest that TSMC is revising upward its capacity plans for SoIC (System-on-Integrated-Chips). By the end of thi...

TSMC operates at full capacity, AMD aims for AI chips reportedly seeks CoWoS-like supply chain. In 2023, NVIDIA led the global AI chip development, and in 2024, the global demand for AI chips is expected to continue to surge due to the expansion of end-user applications such as PCs and mobile pho...

Samsung, the Korean tech giant, has unveiled SAINT technology to counter TSMC's advanced CoWoS packaging, aiming to benefit from the surging AI market. Market reports reveal that Samsung is strategically procuring a substantial amount of 2.5D packaging equipment, indicating a keen awareness of the s...

The AI landscape witnesses a robust surge with the consecutive launches of AMD's "Instinct MI300" series AI chips and NVIDIA's upcoming "B100" GPU structure. This wave of innovation propels a flourishing demand for AI-related Outsourced Semiconductor Assembly And Test Services (OSAT), surpassing in...

The demand for TSMC's CoWoS advanced packaging is skyrocketing. Following NVIDIA's expansion confirmation in October, there are reports in the industry that major clients like Apple, AMD, Broadcom, Marvell, and others are also placing additional orders with TSMC. To meet the demands of these five...