Subject


Arizona


2025-08-07

[News] TSMC Reportedly Fast-Tracks 2nd AZ Fab in U.S. Push: Tool Move-In by Oct 2026, Targets 4Q27 Production

U.S. President Trump announced on the 7th plans to impose a 100% tariff on semiconductors, while noting that chips manufactured in the U.S. would be exempt. As such, TSMC is expected to qualify for the exemption. In line with this, MoneyDJ notes that TSMC is accelerating construction of its U.S. fab...

2025-07-28

[News] TSMC’s Arizona Fab Reportedly Meets Only 7% of U.S. Chip Demand for Now Despite Expansion Push

TSMC is accelerating its U.S. push, with its third Arizona fab (F21 P3) reportedly breaking ground in Q2. Still, the foundry giant is playing catch-up—Treasury Secretary Scott Bessent revealed TSMC’s Arizona site currently meets just 7% of U.S. chip demand, according to Wccftech via The The All-...

2025-07-24

[News] AMD CEO Says TSMC Arizona Chips Cost Up to 20% More Than Taiwan’s but Are Worth It

At an AI event in Washington on Wednesday, AMD CEO Lisa Su stated that chips produced at TSMC’s Arizona plant cost “more than 5% but less than 20%” more than those made in Taiwan, according to Bloomberg. She also noted that AMD expects to receive its first batch of chips from the Arizona facil...

2025-07-17

[News] TSMC Accelerates 2nd Arizona Fab Production; Ramp-Up Schedules for Japan, Germany Undisclosed

TSMC CEO C.C. Wei leads the company’s 2025 second quarter earnings call today and shares the latest progress on the company's Arizona facilities. Notably, he says that construction of the second fab in Arizona, which uses the 3nm process, has already been completed, and the company is now working ...

2025-07-10

[News] TSMC Reportedly to Break Ground on U.S. Advanced Packaging Plants in 2028, Starting with SoIC

As TSMC accelerates its U.S. expansion with progress on its third Arizona fab, it still has to ship cutting-edge chips—like those for NVIDIA—back to Taiwan for advanced packaging. But that’s set to change. According to MoneyDJ, the foundry giant plans to break ground on two advanced packaging ...

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