According to a report from Economic Daily News, Foxconn Group is advancing into the field of advanced packaging with a strategic alliance between Taiwan and Japan, focusing on the trending panel-level fan-out packaging (FOPLP). Following Innolux's related developments in Taiwan, another of Foxconn's...

TSMC's advanced CoWoS packaging capacity is in severe shortage, and just as the new plant in the Chiayi Park of Southern Taiwan Science Park began construction for expansion, according to a report from Economic Daily News citing sources, it has stated that TSMC intends to build another advanced pack...

On June 21, ASE Group announced that ASE Semiconductor will collaborate with Hung Ching Construction to build a K28 plant in Kaohsiung. The project is expected to be completed in the fourth quarter of 2026 and will focus on end testing of advanced packaging processes, and high-performance computing ...

According to a report from CNA, Taiwanese semiconductor testing and packaging giant ASE announced on June 21st that it will collaborate with Hung Ching Development & Construction Corporation to jointly build the K28 plant in Kaohsiung. Scheduled for completion in Q4 2026, the facility will repor...

According to a previous report from Nikkei citing sources, TSMC is rumored to be entering the fan-out panel-level packaging sector. As cited in a report from UDN, Intel and Samsung have also announced plans to invest in this area. With TSMC, the leading wafer foundry, joining the fray, the three sem...