As noted by TechNews, citing Chosun Daily, Roh Tae-moon, Acting DX Division Head of Samsung Electronics, stated that Samsung’s first tri-fold smartphone is expected to launch before the end of this year. The report adds that Roh said the device has entered the “final stages” of development. ...

As China accelerates its memory ambitions with DDR5 capacity reportedly on the rise, domestic NAND powerhouse YMTC has made another bold move. According to Star Market Daily, Changcun Phase III (Wuhan) Integrated Circuit Co., Ltd. was officially established on September 5, with Chen Nanxiang, YMTC�...

Since Lip-Bu Tan took over as CEO in March, Intel has continued to reshuffle its leadership. According to the company, Michelle Johnston Holthaus—head of Intel Products—will step down after more than three decades with the firm. Over her tenure, Holthaus held numerous senior leadership roles,...

As SEMICON Taiwan 2025 kicks off this week, the Silicon Photonics Global Summit took the spotlight on September 8, featuring senior executives from global chip giants such as TSMC, NVIDIA, and Broadcom sharing their latest progress. According to Commercial Times, K.C. Hsu, Vice President of Integrat...

AMD may be gearing up for a comeback in the high-performance GPU arena. As per Tom’s Hardware, AMD SoC chief architect Laks Pappu recently revealed on LinkedIn that the company is developing next-generation GPUs with advanced 2.5D and 3.5D chiplet packaging. AMD’s current Radeon RX 9000 serie...