While Micron reportedly passed NVIDIA’s verification and became the first of the big three memory makers to ship SOCAMM (Small Outline Compression Attached Memory Module), the U.S. AI chip giant may revise its adoption plan for this new low-power DRAM (LPDDR) server memory module—a move that cou...

According to ITHome, citing Leiphone, sources say that Amazon Web Services (AWS) Greater China is preparing for a round of layoffs expected to take place between late September and October. The scale could range from 20% to 30%, with secondary teams said to be the hardest hit. AWS Greater China curr...

Ahead of a new round of U.S.-China trade talks in Spain from September 14 to 17, Beijing has stepped up pressure on Washington. On Saturday, China’s Ministry of Commerce announced anti-dumping investigations targeting U.S. analog chips from Broadcom, Texas Instruments, Onsemi, and ADI, according t...

According to Economic Daily News, Infineon announced in March that it will launch RISC-V–based automotive microcontrollers (MCUs). Infineon plans to provide samples to partners for product development in 2026, with mass production slated for 2028–2029. Notably, these RISC-V–based MCUs will be ...

According to The Elec, KAIST Professor Kim Jeong-ho noted that HBF (High Bandwidth Flash)—NAND flash stacked like HBM—could become a decisive factor for the future of AI. As the report explains, HBF resembles HBM in structure, with dies stacked and linked by through-silicon vias (TSVs). The key ...