Samsung, the Korean tech giant, has unveiled SAINT technology to counter TSMC's advanced CoWoS packaging, aiming to benefit from the surging AI market. Market reports reveal that Samsung is strategically procuring a substantial amount of 2.5D packaging equipment, indicating a keen awareness of the s...

In the past few years, the rapid growth of the Mini LED backlight market has been closely tied to the support from consumer electronics giant Apple. Apple pioneered the integration of Mini LED backlight technology into tablet products, sparking increased demand for Mini LED technology in the consume...

As reported earlier, the global provider of outsourced semiconductor packaging and test services, Amkor, has been set to establish its presence in Arizona, USA, providing advanced packaging services for Apple chips manufactured by TSMC. According to reports from South Korean media, the alliance f...

SiC industry giant Wolfspeed issued a press release on December 4th, formally selling its radio frequency business (Wolfspeed RF). Back to August 22nd of this year, Wolfspeed had announced the sale of Wolfspeed RF to the U.S. semiconductor company MACOM Technology Solutions Holdings, Inc. Unde...

Compared to last week, there is no notable change in DRAM spot price. It is relatively stable in this week. On NAND Flash, there was a 20%+ growth in NAND Flash wafer contract prices last month, making buyers stock and sellers negotiate the price. It leads a surge in the NAND flash wafer spot price ...