As leading foundries and packaging giants such as TSMC and ASE ramp up panel-level packaging (PLP) capacity, STMicroelectronics has emerged as an unexpected contender. The company announced it will establish a new pilot line at its Tours site in France to advance next-generation PLP technology, with...

According to Commercial Times, the global memory market continues to see price increases, driven by urgent orders from generative AI and major cloud service providers (CSPs). Industry sources note that both DDR4 and DDR5 contract and spot prices are set to post double-digit gains in October. The rep...

According to Chosun Biz, sources say Samsung has secured a foundry contract with IBM, one of the top five players in the data center CPU market, to produce its next-generation Power11 chip. The chip will be manufactured on Samsung’s refined 7nm (7LPP) process, and in collaboration with IBM, the co...

NVIDIA on Thursday stunned markets with a $5 billion investment in Intel and the announcement of a joint effort to develop chips for PCs and data centers—a striking vote of confidence in the struggling U.S. chipmaker, coming just weeks after Washington took a historic 10% federal stake. In additio...

On September 12, Japan’s Ministry of Economy, Trade and Industry (METI) announced a subsidy of up to JPY 536 billion for Micron’s DRAM plant in Hiroshima. The funding will support new plant construction, production, and R&D, with a particular focus on high-bandwidth memory (HBM) and extreme ...