Masahiro Okitsu, President of Sharp, a subsidiary of Foxconn, announced in a joint interview with Japanese media that the Sakai Display Product (SDP) plant, which produces large-size LCD panels for TVs, will cease production earlier than planned. Initially scheduled for the end of September, the sh...

Huawei's Consumer Business CEO, Richard Yu, has publicly revealed plans for Huawei's next-generation tri-folding phone for the first time. He stated that this product, widely considered challenging to achieve in the industry, is finally about to be launched after five years of development. Accord...

As Samsung actively expands its high-bandwidth memory (HBM) capabilities, it is also striving to enhance the penetration rate of its existing memory products in mobile devices such as smartphones. On July 16, Samsung announced that it has completed verification of its latest LPDDR5X DRAM, which can ...

According to a report by Yonhap News Agency, data released by Korea's Ministry of Science and information and communication technology ICT on July 15 shows that in the first half of this year, Korea's ICT industry exports grew by 28.2% YoY to USD 108.85 billion, setting the second-highest record for...

As per a report from Korea Economic Daily citing unnamed sources on July 15th, Samsung Electronics is preparing to mass-produce the logic die for HBM4 using its advanced 4nm process. The logic die, situated at the bottom of the chip stack, is a core component of HBM. Memory manufacturers are alr...