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2025-11-10

[News] TSMC Reportedly Plans 12 New Advanced Process and Packaging Fabs in Taiwan as 2nm Supply Tightens

Recently, NVIDIA CEO Jensen Huang made a whirlwind visit to Taiwan, attending TSMC’s sports day. Sources said he came to request more chips from the company, underscoring the strong demand for its advanced process capacity. According to Liberty Times, as AI chip demand soars, TSMC’s 3nm capacity...

2025-11-10

[News] Samsung LPDDR6 Memory Specs Unveiled: 10.7Gbps Speed on 12nm; Reportedly Eyes 14 Gbps

As Samsung pushes forward with its HBM4 timeline, it’s also making strides in next-gen DRAM. CES and Samsung’s press release show that its LPDDR6 has been named a 2026 Innovation Award Honoree in the Mobile Devices, Accessories & Apps category. The newly revealed specs, notably, point to a 1...

2025-11-10

[News] Decoding China’s Lithography Push to Challenge ASML: From SiCarrier to Alternative EUV Paths

As Bejing advances toward semiconductor self-reliance, high-end chipmaking tools are indispensable—yet lithography, controlled by ASML, poses the biggest challenge, with its EUV machines for sub-5nm chips off-limits for export. Notably, 42% of ASML’s Q3 2025 sales came from China, underscoring t...

2025-11-10

[News] ASML’s Magic Uncovered: Tech and Partners Behind Its EUV Edge China Can’t Replicate

While China is racing to close the lithography gap with homegrown tools from Huawei-linked SiCarrier and Yuliangsheng, the reality is that extreme ultraviolet (EUV) lithography remains an entirely different universe. Machines capable of printing sub-5nm chips are not just complex—they’re the pin...

2025-11-07

[News] Samsung Vice Chairman Chung Hyun-ho Retires; Permanent Business Support Office Replaces TF

Major leadership changes have been announced at Samsung. According to Chosun Daily, Vice Chairman Chung Hyun-ho, often described as Samsung Electronics’ “second-in-command,” has stepped down as head of the Business Support Task Force (TF) and retired from frontline management. The report adds ...

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