AI is fueling a surge in demand for advanced packaging, and TSMC’s capacity in this segment is reportedly running tight. According to Economic Daily News, with most of TSMC’s advanced packaging capacity taken up by NVIDIA, several major U.S. AI chipmakers have rushed to seek help from Powertech,...

While Micron has already sold out its 2026 HBM supply, the company appears to be taking a cautious approach to capacity expansion. According to syracuse.com and Spectrum News 1, the opening of its first two chip fabs in Clay, New York, will be delayed by two to three years, meaning neither facility ...

Recently, NVIDIA CEO Jensen Huang made a whirlwind visit to Taiwan, attending TSMC’s sports day. Sources said he came to request more chips from the company, underscoring the strong demand for its advanced process capacity. According to Liberty Times, as AI chip demand soars, TSMC’s 3nm capacity...

As Samsung pushes forward with its HBM4 timeline, it’s also making strides in next-gen DRAM. CES and Samsung’s press release show that its LPDDR6 has been named a 2026 Innovation Award Honoree in the Mobile Devices, Accessories & Apps category. The newly revealed specs, notably, point to a 1...

As Bejing advances toward semiconductor self-reliance, high-end chipmaking tools are indispensable—yet lithography, controlled by ASML, poses the biggest challenge, with its EUV machines for sub-5nm chips off-limits for export. Notably, 42% of ASML’s Q3 2025 sales came from China, underscoring t...