Micron Technology has announced plans to invest JPY 1.5 trillion (approximately USD 9.6 billion) to build a new factory dedicated to high-bandwidth memory (HBM) chip production in Hiroshima, Japan. The facility will be located within Micron’s existing Hiroshima site, with construction scheduled to...

With AI compute demands soaring, silicon photonics is emerging as a next-generation technology poised to reshape the landscape. According to Hankyung, sources say that Samsung Electronics’ Device Solutions (DS) Division has designated the technology as a future strategic priority and begun recrui...

Buzz is building as tech giants like Google and Meta consider Intel’s EMIB advanced packaging, and Team Blue is going full throttle. ETNews reports that Intel is understood to have established its EMIB process at Amkor's Songdo K5 facility in South Korea—its first-ever move to outsource such hig...

As memory makers push deeper into custom HBM logic dies for the HBM4 era, foundries—led by TSMC—are stepping up with more breakthroughs. German outlet HardwareLUXX reports that TSMC’s custom HBM4E, currently dubbed C-HBM4E, will leap to the N3P node. Along with dropping voltage from 0.8 V to 0...

On November 27, TrendForce successfully hosted the “2026 Top 10 Technology Market Trends & TechFuture Awards 2025,” on which it unveiled annual outlook for wafer foundry, memory, AI server, compound semiconductor, energy storage, AI robotics and other core technology sectors, providing forwa...