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2026-03-19

[News] Kioxia Reportedly to End Slim NAND Packages, Final Shipments due March 2027

Please note that this article cites information from TechNews, The Elec, and Kioxia. As memory giants restructure capacity amid tight supply, Japan’s Kioxia joins the wave, with a client notice indicating it will discontinue Thin Small Outline Package (TSOP) products, final shipments set for Ma...

2026-03-19

[News] imec Secures ASML’s Most Advanced EXE:5200 High-NA EUV for Sub-2nm; 4Q26 Qualification Target

Please note that this article cites information from imec, Reuters, Intel, SK hynix, Korea Economic Daily, Bloomberg, and The Elec. Belgian chip research institute imec announced that it has received an ASML tool that could advance next-generation chipmaking. According to its press release, imec ...

2026-03-19

[News] AMD Secures Samsung HBM4 for MI455X; Deal May Tie Partial AI Chip Shift to Samsung Foundry

Please note that this article cites information from Samsung, Chosun Biz, and Yonhap News. AMD has secured HBM4 supply from Samsung, but the deal reportedly includes a key condition that could benefit Samsung’s foundry business. Samsung is expected to supply HBM4 for AMD’s Instinct MI455X GPU...

2026-03-19

[News] Micron Ramps FY26 Capex to $25B, Signs First 5-Year Customer Deal

Please note that this article cites information from Reuters, Investing.com, ZDNet, CNBC and Micron. Micron is riding the AI memory upcycle, delivering strong 2QFY26 results and guiding third-quarter revenue above market expectations. Even more striking, the company flagged a major step-up in capit...

2026-03-19

[News] China Achieves 14-Inch SiC Breakthrough, Intensifying Global Large-Wafer Competition

On March 11, Tiancheng Semiconductor announced that it had successfully developed a 14-inch silicon carbide (SiC) single crystal using self-developed equipment, with an effective thickness of 30 mm. The breakthrough marks China’s transition in large-sized SiC materials—from the “12-inch adopti...

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