Back-end semiconductor equipment suppliers are increasingly focusing on High Bandwidth Flash (HBF), a next-generation memory technology designed for AI inference. According to ZDNet, industry sources said that South Korean and international back-end equipment makers have begun developing thermal com...

SK hynix is reportedly preparing a major DRAM capacity expansion. According to The Elec, the company has shared plans with key suppliers to nearly double its DRAM wafer production capacity by 2030–2031 from current levels. The plan aligns with comments made by SK Group Chairman Chey Tae-won at Co...

Several vendors are reportedly ramping up DDR4 production as demand remains strong. According to Wccftech, higher DDR5 prices are contributing to stronger demand for DDR4 platforms. While DDR4 prices have also increased, they remain significantly lower than those of comparable DDR5 modules. The repo...

As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate solutions, with glass substrates emerging as a focal point. According to Sisa Journal, the technology is expected to begin early commercialization in 2027, move through a ramp-up phase ...

Laser annealing adoption appears to be broadening. According to ETNews, the thermal treatment process is expanding beyond its traditional use in silicon (Si) wafers to silicon carbide (SiC), a material widely regarded as a leading candidate for next-generation power semiconductors. The report adds t...