In a TechSurge podcast released last week, Intel CEO Lip-Bu Tan signaled the chip giant’s growing interest in memory, saying the company does not intend to miss the next major wave. As Intel explores technologies such as cross-batch memory (XBM) and Z-angle memory (ZAM), it is worth looking back a...

Heat is emerging as one of the biggest bottlenecks for AI infrastructure, prompting industry experts to argue that AI itself could become part of the solution. According to ETNews, KAIST Professor Kim Joung-ho warned that growing thermal challenges could constrain AI expansion as both system semicon...

Samsung is stepping up its capacity expansion. According to ZDNet, the company plans to break ground in September on a new high-bandwidth memory (HBM) fab at its Onyang Campus in South Chungcheong Province, backed by a KRW 6 trillion investment. The project received approval a month ahead of schedul...

SK hynix is moving from a memory supplier to a bigger role in the AI infrastructure. According to the company, it has teamed up with leading researchers worldwide to lay out a roadmap for co-packaged optics (CPO) in the journal Nature Electronics. Notably, beyond its HBM leadership, SK hynix’s ...

Competition between Intel and TSMC in advanced process is intensifying as both push ahead with their next-generation roadmaps. According to Commercial Times, Intel’s Razor Lake processors would reportedly adopt TSMC’s 2nm N2X process, potentially expanding Intel’s use of TSMC across the 2nm fa...