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2025-11-11

[News] SK hynix Reportedly Eyes 321-Layer QLC NAND in 2H26; Future of Solidigm IPO Uncertain

As SK hynix takes the lead in the HBM4 era, the memory powerhouse is reportedly accelerating its push into NAND—a segment long considered secondary. DealSite reports that the company plans to start shipping 321-layer Quad-Level Cell (QLC) NAND products in the second half of 2026 and significantly ...

2025-11-11

[News] Intel CTO and AI Chief Departs for OpenAI; CEO Lip-Bu Tan Steps In to Lead AI Push

Intel has made AI a cornerstone of its turnaround strategy, yet recent leadership changes underscore the challenges of executing that vision. According to Reuters, the company’s chief technology and AI officer, Sachin Katti, has left to join ChatGPT maker OpenAI, prompting CEO Lip-Bu Tan to take d...

2025-11-11

[News] Memory Price Surge: Macronix NOR Flash Reportedly +30% in 1Q26, SanDisk NAND Up in Nov.

As the memory supersycle accelerates, the latest wave of price increases has spread from DRAM to other segments, with major suppliers reporting sold-out orders and aggressive price adjustments. Taiwan’s Macronix, according to the Economic Daily News, is said to be preparing a 30% price hike for NO...

2025-11-11

[News] SK hynix, Samsung, and SanDisk Bet on HBF — The Next Battleground in Memory Sector

Kim Jung-Ho, a professor at KAIST and widely known as the “father of HBM (High Bandwidth Memory),” recently made a striking statement on a YouTube program: “In the AI era, the balance of power is shifting — from GPU to memory.” According to Kim, memory will play an increasingly pivotal ...

2025-11-11

[News] SK hynix Reportedly Explores High-Bandwidth Storage Stacking NAND and DRAM

After solidifying its leadership in HBM, SK hynix is teaming up with SanDisk to develop High-Bandwidth NAND Flash (HBF), which enhances HBM with NAND for AI inference workloads. At the same time, the company is reportedly exploring a broader memory spectrum: High-Bandwidth Storage (HBS). As ETnews r...

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