Amid surging demand for advanced packaging, key materials are now hot commodities for tech giants. According to EE Times China and the Economic Daily News, Japan’s Asahi Kasei, a top PSPI (photosensitive polyimide) supplier to semiconductor firms like TSMC and Samsung, plans to cut PIMEL shipments...

Recently, the research team led by Professor Wang Xiaohong from the School of Integrated Circuits at Tsinghua University has made a breakthrough in the study of the dynamic response limits of high-frequency supercapacitors. For the first time, they experimentally quantified the upper limit of the dy...

According to a report from Business Korea, South Korea’s Ministry of Trade, Industry and Energy and industry sources on May 25 indicated that China’s Ministry of Commerce has approved rare earth exports this month to several South Korean firms that procure materials through Chinese suppliers. Th...

Samsung is continuing to strengthen its foundry operation and is reportedly planning to adopt glass substrates for chip packaging, according to Wccftech citing etnews. The South Korean tech giant intends to replace the traditional silicon interposer with a glass interposer by 2028, as the report not...

The impact of U.S. export restrictions on advanced processors remains in question, with a recent Tom’s Hardware report raising concerns over Russia’s access to chips. Citing Russian outlet Kommersant, Tom’s Hardware notes that FCS Russia (the Federal Customs Service of Russia) recorded a stee...