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2025-09-19

[News] Samsung Reportedly Secures Foundry Deal for IBM Power11 Using 7LPP EUV Process

According to Chosun Biz, sources say Samsung has secured a foundry contract with IBM, one of the top five players in the data center CPU market, to produce its next-generation Power11 chip. The chip will be manufactured on Samsung’s refined 7nm (7LPP) process, and in collaboration with IBM, the co...

2025-09-19

[News] Mega NVIDIA-Intel Deal: No Chipmaking Orders, Co-Developed Products Might Launch 2027–28

NVIDIA on Thursday stunned markets with a $5 billion investment in Intel and the announcement of a joint effort to develop chips for PCs and data centers—a striking vote of confidence in the struggling U.S. chipmaker, coming just weeks after Washington took a historic 10% federal stake. In additio...

2025-09-19

[News] Japan Pledged JPY 536 Billion to Micron, Escalating Global Semiconductor Subsidy Race

On September 12, Japan’s Ministry of Economy, Trade and Industry (METI) announced a subsidy of up to JPY 536 billion for Micron’s DRAM plant in Hiroshima. The funding will support new plant construction, production, and R&D, with a particular focus on high-bandwidth memory (HBM) and extreme ...

2025-09-19

[News] India’s Chip Push Grows as ARM Unveils Design Office for Advanced Chips, Including 2nm

India’s chip ambitions continue to take shape. Following the launch of the country’s first 3nm design center led by Renesas, ARM’s newly inaugurated Bengaluru office is reported to kick off India’s advanced 2nm chip design, according to BISinfotech and IANSlive. On September 16, Union Min...

2025-09-18

[News] TSMC Reportedly Denies Halting 2nd Phase of Chiayi, Taiwan Packaging Plant Amid U.S. Expansion

According to Central News Agency,  concerns have arisen that TSMC’s U.S. investment could crowd out its broader plans. Market rumors suggest the company is accelerating construction of its second and third Arizona fabs while halting the second phase of its advanced packaging plant in Chiayi, Taiw...

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