Shortly after confirming that it had begun sampling its 192GB SOCAMM2 last October, Micron has moved a step further. According to a new press release, the company has started shipping customer samples of a 256GB SOCAMM2 — currently the highest-capacity LPDRAM module in the industry. Micron said...

In early February 2026, competitive dynamics in the global silicon carbide (SiC) industry are coming into sharper focus. Disclosures and earnings call transcripts from companies including Wolfspeed, Infineon Technologies, and STMicroelectronics indicate that while a slowdown in the electric vehicle ...

With the launch of Micron’s semiconductor assembly and test facility in Sanand, Gujarat on February 28, India has formally stepped onto the global memory map. Below are key highlights of the new plant, its role in Micron’s worldwide operations, and why it represents a pivotal milestone in India�...

In the race for next-generation HBM, packaging has emerged as a new focal point. According to ZDNet, industry sources say SK hynix is advancing a packaging overhaul aimed at enhancing stability and performance, with the technology currently under validation. If successfully commercialized, it could ...

As traditional materials approach their physical limits, glass substrates are coming to the forefront of next-generation chip packaging. According to Global Economic, SKC recently announced plans to allocate more than ₩600 billion—over half of its ₩1 trillion capital increase—to its glass su...