Recent reports that Apple and Qualcomm are recruiting engineers with EMIB (Embedded Multi-die Interconnect Bridge) expertise suggest Intel’s packaging technology is regaining momentum—helped in part by the tight squeeze on TSMC’s capacity. According to the Commercial Times, the shift indicates...

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in Arizona, with construction set to begin in 2H26 and production by 2028. The report also details TSMC...

According to TechNews, citing TechPowerUp and Wccftech, Apple’s next-generation M5 chips—set to be used in new MacBook Pro models launching in 2026—will reportedly feature a major upgrade in packaging technology, adopting LMC (Liquid Molding Compound) exclusively supplied by Taiwan’s Eternal...

As semiconductor giants embrace fan-out panel-level packaging (FOPLP) for larger, more efficient chip designs, Japan’s Nikon is joining the race. The company has begun taking orders in July for its new DSP-100 digital lithography system, designed specifically for 600 mm square panels used in advan...

As the chip war heats up, the U.S. BIS unveiled an updated semiconductor whitelist on February 4, per its website. Commercial Times reports that the list, split into IC design (IW) and packaging & foundry (PW) categories, is likely to spark a shift in chip orders from China—a boost for Taiwan�...