As traditional materials approach their physical limits, glass substrates are coming to the forefront of next-generation chip packaging. According to Global Economic, SKC recently announced plans to allocate more than ₩600 billion—over half of its ₩1 trillion capital increase—to its glass su...

As Samsung accelerates fab approvals and equipment installations, questions are emerging about the pace of mass production at the Taylor plant. Korea JoongAng Daily reports that the start of full-scale production at Samsung’s Texas facility is now expected to slip to early 2027. If confirmed, t...

As Israel enters a state of emergency, shipments from Israel-based foundries have reportedly been disrupted, prompting global companies to shift orders. According to Economic Daily News, Israel’s largest foundry and a top-ten global player, Tower Semiconductor, has faced shipment constraints, lead...

Just weeks after unveiling Panther Lake at CES in January, Intel returned to the spotlight at MWC 2026 with the Xeon 6+ “Clearwater Forest,” showcasing the progress of 18A. According to TechPowerUp, the processor features one of Intel's most advanced chiplet designs yet: the package combines 12 ...

In the HBM industry, performance metrics such as speed and stack count typically draw the most attention, but power efficiency is emerging as an equally critical factor. According to Hankyung, as the industry transitions to HBM4E, Samsung is proposing a structural redesign of the HBM4 power network....