China has been accelerating its push for semiconductor self-reliance amid U.S. restrictions, and a new article written by the country’s leading chip executives has outlined a strategic roadmap. According to South China Morning Post, top figures in China’s semiconductor industry co-authored the p...

Major semiconductor companies are reportedly considering easing thickness standards for next-generation HBM, as future generations such as HBM4E and HBM5 are expected to adopt 20-layer stacking. According to ZDNet, while the current HBM4 thickness standard is 775 micrometers (μm), industry discussi...

Amid uncertainty surrounding exports of NVIDIA’s H200 GPU to China, U.S. officials are reportedly weighing a new framework to tighten oversight of AI chip shipments. According to Reuters, Washington is considering rules that could require foreign governments to commit to investing in U.S. AI data ...

As chip manufacturing approaches the sub-2nm era, spotting atomic flaws in next-generation silicon grows ever more challenging. Now, Cornell researchers, partnering with foundry giant TSMC and chipmaking tool player ASM, have for the first time directly visualized atomic-scale defects using high-res...

Taiwanese DRAM maker Nanya Technology expects DRAM supply tightness to persist through 2028 and is ramping up expansion, while also revealing, for the first time, progress on its custom AI memory development. Citing company president Lee Pei-Ing, Commercial Times reports that some products have alre...