Subject


Semiconductors


2026-03-02

[News] Only 1nm, Record-Low Power Consumption: Peking University Team Achieves Chip Breakthrough

According to the School of Electronics at Peking University, the university has made a breakthrough in the field of non-volatile memory. The research team led by Qiu Chenguang and Peng Lianmao has successfully scaled the physical gate length of a ferroelectric transistor down to the 1-nanometer limi...

2026-02-27

[News] SJ Semiconductor Reportedly Wins IPO Nod as China Bets on Advanced Packaging

China’s drive for semiconductor self-reliance is advancing, with fresh momentum in advanced packaging. According to South China Morning Post, SJ Semiconductor, a key player in China’s advanced chip packaging sector, has secured approval to list on Shanghai’s STAR Market. The report notes that ...

2026-02-26

[News] Apple Reportedly Eyes Chinese Memory as Leverage Against Samsung, SK hynix Amid Rising Costs

Apple is reportedly exploring Chinese memory suppliers as prices continue to climb. According to Commercial Times, citing Wccftech, sources say Apple is evaluating products from major Chinese memory makers for potential use as early as the iPhone 18 series, as well as MacBooks. The move aims to enha...

2026-02-26

[News] Samsung Reportedly Ends Last 2D NAND Line as Early as March, Repurposes Facility for 1C DRAM

Amid tightening memory supply, cutting MLC NAND output is becoming a clear trend among major memory makers—but Samsung’s 2D NAND era could end sooner than expected. According to The Elec, the company may halt 2D NAND production at Hwaseong Line 12 as early as March and converting the facility in...

2026-02-26

[News] SK hynix & Sandisk Kick Off Global Standardization of HBF, Market Set to Surge by 2030

As the AI industry shifts from model training toward inference — existing memory architectures are increasingly reaching their limits, positioning HBF (High Bandwidth Flash) as a key next-generation solution. Marking a major step forward, SK hynix and Sandisk jointly hosted the “HBF Spec. Standa...

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