On May 7, NEO Semiconductor announced a major breakthrough in its 3D X-DRAM technology series: the industry’s first 3D X-DRAM cell structures based on 1T1C and 3T0C architectures. According to NEO Semiconductor, the new technology is designed to deliver unprecedented density, power efficiency, ...

As memory giants accelerate development in HBM4 and high-layer NAND, hybrid bonding technology is drawing heightened attention. South Korean leaders Samsung Electronics and SK hynix remain behind in key patents, according to a report from ZDNet. The report highlights that Samsung and SK hynix have d...

Previous industry sources suggested that NVIDIA was exploring the use of Intel’s 18A process for its gaming GPUs, according to Tom’s Hardware. Now, interest in the 18A node appears to be growing. Chosun Biz notes that Microsoft has reportedly signed a large-scale foundry deal with Intel using th...

Before Biden’s three-tier AI chip curbs comes into effect, Trump reportedly plans to hit the brakes. According to Bloomberg and Reuters, the AI diffusion rule will not take effect on May 15 as previously scheduled, with Trump pushing to revamp chip export policy. As per the reports, the Commerc...

In 2020, Apple announced its transition to Apple Silicon, successfully replacing Intel processors with more efficient and faster chips in less than three years. Today, Apple intends to replace Qualcomm’s modem chips and gradually internalize all network functionalities. Apple’s first in-house...