As semiconductor giants embrace fan-out panel-level packaging (FOPLP) for larger, more efficient chip designs, Japan’s Nikon is joining the race. The company has begun taking orders in July for its new DSP-100 digital lithography system, designed specifically for 600 mm square panels used in advan...

According to a report from MoneyDJ, citing ITHome, Chinese AI chipmaker Cambricon announced on the 17th that it has revised its A-share private issuance plan for 2025. Under the updated proposal, the company plans to issue no more than 20.9175 million shares, aiming to raise up to RMB 3.9853273 bill...

While Goldman Sachs expects HBM prices to decline next year as competition intensifies and pricing power shifts to major customers, the firm also notes that although GPUs will remain the main growth engine, ASICs are set to see even faster adoption in 2026. Building on this, Chosun Biz notes that th...

Japan’s Rapidus hit a key milestone on its path to 2nm mass production by 2027, as it announced on July 18 that prototyping has begun for its 2nm gate-all-around (GAA) chips at the IIM-1 foundry in Chitose, Hokkaido. The company also confirmed that initial test wafers have entered electrical testi...

According to Tom’s Hardware, citing Oregon Live, Intel may be planning further layoffs in Oregon. Oregon Live states that the company has already cut at least 5,400 jobs in the state since August, reducing its local workforce to around 18,000—the lowest level in over a decade. In mid-July, In...