Subject


Semiconductors


2025-08-14

[News] DeepSeek R2 Model Launch Reportedly Delayed Amid Huawei Ascend Chip Hurdles

According to Financial Times, DeepSeek has delayed releasing its new model, reportedly due to unsuccessful attempts to train it on Huawei’s chips—highlighting the limits of Beijing’s drive to replace U.S. technology. The report, citing sources, says DeepSeek has faced ongoing technical hurd...

2025-08-14

[News] Japan’s Kanto Denka Fire Threatens NF₃ Supply, Alerts Chipmakers Like TSMC, Samsung and Rapidus

A fire at Japanese industrial gas maker Kanto Denka Kogyo’s nitrogen trifluoride operations is raising alarms over semiconductor supply chain disruptions, as the company supplies major clients including TSMC, Samsung, Micron, and Japan’s Kioxia, Sony, and Rapidus—highlighting the potentially w...

2025-08-14

[News] Intel Rolls Out “USAI” Web Page Showcasing Commitment to U.S. Manufacturing

According to Wccftech, Intel has launched a dedicated web page showcasing its “USAI” campaign, aimed at reshaping market perception by emphasizing the company’s close ties to the administration and its commitment to U.S. manufacturing and technology. On the page, Intel states that it has be...

2025-08-14

[News] Samsung Reportedly Plans $170M Chip Packaging R&D Center in Yokohama, Opening Mar. 2027

According to The Korea Economic Daily, sources indicate that Samsung Electronics will invest 25 billion yen (about $170 million) to establish an advanced chip packaging research and development center in Yokohama, Japan. The report adds that the City of Yokohama, which announced Samsung’s R&D ...

2025-08-14

[News] NVIDIA Reportedly Denies Rubin Delay as AMD MI450 Spurs Redesign Speculation

With its China-focused H20 still facing uncertainty despite U.S. approval, NVIDIA’s next-gen AI chip Rubin has drawn fresh attention amid delay rumors. But the company told Barron’s and Seeking Alpha the claims are false, adding Rubin remains on schedule. The reports, citing Fubon Research, w...

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