At TSMC’s earnings call on the 17th, the company revealed that its CoWoS (Chip-on-Wafer-on-Substrate) capacity will double each year in 2024 and 2025, but demand will continue to outpace supply. According to a report from Money DJ, the CoWoS expansion wave is expected to extend into 2026, promisin...

After posting record high profit in the third quarter and seeing healthy growth in the next five years, TSMC may now be facing another unexpected challenge, as the U.S. Commerce Department is reportedly probing the foundry giant to determine if it has manufactured smartphone or AI chips for Huawei, ...

According to a report by ZDNET Korea, SK Hynix has scaled back its less profitable CMOS image sensor (CIS) and foundry businesses while reinforcing a strategy that focuses on high-margin high-bandwidth memory (HBM) and AI memory. Citing industry sources, ZDNET Korea noted that SK Hynix has reduce...

The global semiconductor market is nearing the end of its inventory cycle. With the rise of AI-related applications, new energy vehicles, 5G, high-performance computing, and other emerging sectors, industry experts estimate that the global semiconductor industry could reach a valuation of $1 trillio...

At its previous earnings call in July, Samsung has announced the ambitious goal that its HBM sales would increase three to five times in 2H24. However, as it is still struggling to pass the verification of 12-Hi HBM3e products, the company’s prospects for returning to glory in the near term seems ...