While NVIDIA may be better known for its latest advancements in AI accelerators such as Blackwell, the tech giant’s automotive chips are expected to seen explosive growth in 2025, with TSMC and IC design house MediaTek poised to seize this business opportunity, according to a report from Commercia...

Amid the AI boom, global semiconductor giants such as TSMC have been making strides in CoWoS capacity expansion. However, market demand for materials related to advanced packaging has also been brewing, as China is seeing a surge in mergers and acquisitions in the sector recently, according to Chine...

Rumors have been circulating that the Biden administration might announce new export restrictions targeting China around Thanksgiving. Now more details have surfaced, as a report from Bloomberg indicates that additional restrictions on the sale of semiconductor equipment and AI memory chips to China...

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 stacks of HBM...

Following the footsteps of PC makers such as Dell and HP, which reportedly aim to reduce the number of components made in China as quickly as possible, a report by technowvoice suggests that American networking giant Cisco is also joining the ranks, as it has now prohibited suppliers from providing ...