With big techs led by NVIDIA betting on TSMC’s CoWoS, the foundry giant is moving ahead with its CoPoS (Chip-on-Panel-on-Substrate) technology amid strong AI demand. According to MoneyDJ and the Economic Daily News, TSMC’s first CoPoS pilot line is set for 2026, with mass production targeted by ...

According to EETimes China, citing Dutch media outlet de Gelderlander, semiconductor giant NXP is reportedly planning to shut down several 8-inch wafer fabs as it transitions to more efficient 12-inch production. The report states that four 8-inch fabs are slated for closure—one in Nijmegen, the N...

TSMC is fast-tracking its U.S. expansion with a $100 billion investment covering three fabs, two advanced packaging plants, and an R&D center. However, supply chain insiders suggest the locations for the two U.S.-based packaging plants have yet to be decided, according to Liberty Times. TSMC ...

Amid China’s semiconductor consolidation wave to push back against U.S. pressure, local foundry giant SMIC announced on June 5 it is selling its full 14.83% stake in SMIC Ningbo to Shenzhen-listed Goke Microelectronics, according to Sina and the Science and Technology Innovation Board Daily. Pe...

TSMC Chairman C.C. Wei said at yesterday’s shareholder meeting that AI demand remains strong despite tariff concerns—and the momentum is clear. On June 3, major client Broadcom announced it has begun shipping its latest AI-focused networking chip, the Tomahawk 6, according to its press release. ...