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IC Manufacturing, Package&Test


2025-03-19

[News] Apple’s A20 Chip May Stick to TSMC’s N3P Process, Delaying 2nm Adoption but Featuring CoWoS Packaging

IC Manufacturing, Package&Test

In December 2024, industry sources indicated that TSMC's 2nm trial production yield had exceeded 60%, sparking speculation about its first adopters. However, according to Wccftech, Apple—a major TSMC customer known for consistently seeking a competitive edge through advanced manufacturing processe...

2025-03-18

[News] Google Reportedly Teams Up with MediaTek for 7th-Gen TPU as TSMC Takes on Production

IC Manufacturing, Package&Test

As tech giants race to develop their own AI chips, Google is advancing its Tensor Processing Unit (TPU) to the next generation. Reuters, citing The Information, reports that Google plans to partner with Taiwan’s MediaTek on its 7th-generation TPU, set for production in 2026. The chip is expecte...

2025-03-18

[News] Vietnam’s First Wafer Fab Set to Begin Construction

IC Manufacturing, Package&Test

According to recent reports from foreign media, the Vietnamese government has officially approved a wafer fab construction project with a total investment of VND 12.8 trillion (approximately $500 million). This will be Vietnam’s first wafer fab, marking a key breakthrough in the country's semicond...

2025-03-17

[News] Samsung Rumored to Mull on Scrapping 1.4nm Node to Prioritize 2nm/3nm Yield Gains

IC Manufacturing, Package&Test

As Samsung is eager to stem losses in its foundry business, the latest market rumor indicates that the company might plan to cancel its 1.4nm node, according to Techspot and Wccftech. Citing remarks from tech tipster @Jukanlosreve, Wccftech suggests that the move could be made due to foundry stru...

2025-03-14

[News] Intel’s Initial 18A Wafers Reportedly Roll Out in Arizona; Early Mass Production Likely to Follow

IC Manufacturing, Package&Test

Just as semiconductor veteran Lip-Bu Tan steps in as Intel’s CEO, the company’s 18A node seems to be making early strides. TechPowerUp, citing Intel’s engineering manager Pankaj Marria, reports that initial 18A wafers are already rolling out from the Arizona plant. The progress, according t...

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