According to Tom’s Hardware, citing Cosmos, Johns Hopkins University researchers have proposed “beyond-EUV (B-EUV),” a step beyond today’s industry-standard EUV lithography. The method employs 6.5–6.7nm soft X-ray lasers, which the report notes could enable resolutions down to 5nm and belo...

As leading foundries and packaging giants such as TSMC and ASE ramp up panel-level packaging (PLP) capacity, STMicroelectronics has emerged as an unexpected contender. The company announced it will establish a new pilot line at its Tours site in France to advance next-generation PLP technology, with...

NVIDIA on Thursday stunned markets with a $5 billion investment in Intel and the announcement of a joint effort to develop chips for PCs and data centers—a striking vote of confidence in the struggling U.S. chipmaker, coming just weeks after Washington took a historic 10% federal stake. In additio...

India’s chip ambitions continue to take shape. Following the launch of the country’s first 3nm design center led by Renesas, ARM’s newly inaugurated Bengaluru office is reported to kick off India’s advanced 2nm chip design, according to BISinfotech and IANSlive. On September 16, Union Min...

As Samsung accelerates the development of its Taylor plant following a $16.5 billion AI6 order from Tesla, the company is set to receive an additional boost with $250 million (about 346 billion KRW) in subsidies from the state of Texas, according to ZDNet. The move, which comes after Texas grante...