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IC Manufacturing, Package&Test


2025-09-04

[News] First Intel 18A-Based Panther Lake Laptop Unveiled: Acer Leads with 16-Inch Ultralight Model

IC Manufacturing, Package&Test

While Intel’s 18A process continues to face speculation over yield issues—casting doubt on whether it can enter mass production by late 2025 as planned—Taiwan’s Acer has unexpectedly become the first laptop brand to unveil a device powered by Team Blue’s 18A-based Panther Lake processor, a...

2025-09-03

[News] Intel Loses Silicon Photonics Lead to TSMC as Patent Filings Reportedly Plummet Since 2023

IC Manufacturing, Package&Test

As silicon photonics becomes a cornerstone of the AI era, AI chip leader NVIDIA and AMD have joined the competition alongside traditional foundries. Yet, Nikkei reports that Intel—the early pioneer in this sector—has seen its patent filings slump, with TSMC overtaking the U.S. giant since 2023. ...

2025-09-03

[News] US to End TSMC Nanjing Waiver by End-2025: Decoding the Impact on the Foundry and Supply Chain

IC Manufacturing, Package&Test

Hot on the heels of similar moves against Samsung and SK hynix, Washington has now targeted TSMC—informing the chipmaker it will revoke the Nanjing fab’s “validated end user” (VEU) status by December 31, 2025, Bloomberg reported, citing a company statement. As Central News Agency explains...

2025-09-03

[News] Nikon Reportedly Aims Doubled Wafer Alignment Sales by FY27 as 3D Stacking, Wafer Bonding Rise

IC Manufacturing, Package&Test

Shortly after announcing its plan to close the Yokohama Plant, Nikon seems to double down its efforts on advanced node related chipmaking tools. According to Nikkan Shimbun, the Japanese semiconductor equipment firm aims to double sales of its wafer alignment stations—which measure wafer distortio...

2025-09-02

[News] Applied Materials Reportedly Flags Minimal Effect of U.S. Incentives, Offers Nuanced View on China

IC Manufacturing, Package&Test

While TSMC, Samsung, and other semiconductor giants ramp up U.S. investments under the government’s reshoring push, chip equipment leader Applied Materials is taking a different stance. According to Wccftech and Investing.com, CFO Brice Hill noted at the Deutsche Bank Tech Conference that U.S. inc...

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