According to South Korean outlet FnNews, sources say Samsung has completed development of its next-generation smartphone application processor (AP), the Exynos 2600, with mass production expected to begin by the end of September. The report highlights that Samsung is showing strong confidence in the...

According to Economic Daily News, Infineon announced in March that it will launch RISC-V–based automotive microcontrollers (MCUs). Infineon plans to provide samples to partners for product development in 2026, with mass production slated for 2028–2029. Notably, these RISC-V–based MCUs will be ...

As semiconductor heavyweights spearheaded by TSMC accelerate panel-level fan-out packaging (FOPLP) development to revolutionize chip packaging efficiency, the technology is gaining significant traction. According to Commercial Times, supply chain sources reveal that FOPLP production equipment has be...

As SEMICON Taiwan 2025 kicks off this week, the Silicon Photonics Global Summit took the spotlight on September 8, featuring senior executives from global chip giants such as TSMC, NVIDIA, and Broadcom sharing their latest progress. According to Commercial Times, K.C. Hsu, Vice President of Integrat...

Supported by SoftBank’s $2 billion investment and the U.S. government’s 10% ownership stake, Intel has provided a more detailed outlook on its foundry business and key process node roadmap. According to Bloomberg and Investing.com, Team Blue views 2026 as a pivotal year for its manufacturing tec...