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IC Manufacturing, Package&Test


2023-10-31

[News] PSMC Announces First Plant in Miyagi Prefecture in Collaboration with SBI

IC Manufacturing, Package&Test

Powerchip Semiconductor Manufacturing (PSMC), SBI Holdings, Inc., Japan's Miyagi Prefecture and JSMC signed the Memorandum of Understanding on the 31st, confirming that JSMC's first fab will be selected in Japan. The Second Northern Sendai Central Industrial Park in Ohira Village, Kurokawa District,...

2023-10-31

[News] Rumors Suggest All Nvidia B100 Baseboard Manufacturing Orders Are Secured by Wistron

IC Manufacturing, Package&Test

According to CTEE, NVIDIA's forthcoming AI server, the GB200 (B100), slated for a 2024 release, has entered the certification phase in the supply chain. Recent market rumors suggest that Foxconn, originally intended to secure orders for the B100 board, faced certification challenges. As a result, Wi...

2023-10-31

[News] VIS Acquires AUO’s Singapore Plant for Advanced 12-inch Fab on Auto Chip  

IC Manufacturing, Package&Test

According to Economic Daily News, industry insiders said that Vanguard International Semiconductor (VIS) is in talks to acquire land and facilities from AUO's Singapore plant for its first 12-inch fab. The estimated investment for this project is a substantial US$2 billion. VIS is making a strategic...

2023-10-30

[News] TSMC’s Kumamoto Plant Prepares for 2024 Mass Production with 1000+ Employees, Followed by Taiwanese Material Suppliers’ Collaboration

IC Manufacturing, Package&Test

TSMC's new plant in Kumamoto, Japan, is bustling. With more than a thousand employees hard at work, it is on track to commence mass production in 2024. This venture signifies TSMC's commitment to meet customer demands and navigate geopolitical challenges by expanding its overseas production capabili...

2023-10-30

Exploring the Significance of 3D-SOC and 3D-IC in Cutting-Edge 3D Advanced Packaging

IC Manufacturing, Package&Test

As semiconductor manufacturing processes evolve more gradually, 3D packaging emerges as an effective means of prolonging Moore's Law and enhancing the computational prowess of ICs. Within the realm of 3D stacking technology, the Interuniversity Microelectronics Centre (imec) based in Belgium categor...

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