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IC Manufacturing, Package&Test


2023-10-27

[News] ASE Holdings Anticipates Doubling Revenue Share in Advanced Packaging for Next Year

IC Manufacturing, Package&Test

ASE Holdings conducted an earning conference on October 26th to unveil its Q3 financial results and offer insights into future business prospects. All eyes are on ASE's progress in CoWoS advanced packaging. Joseph Tung, the Chief Financial Officer (CFO) of ASE, expressed confidence in AI and ongoing...

2023-10-27

[Insights] Unleashing the Practical Impacts of U.S. Semiconductor Export Policies on China

IC Manufacturing, Package&Test

On October 17, 2023, the U.S. government unveiled an updated set of regulations for semiconductor exports, introducing stricter standards for advanced AI chips. Additionally, these regulations expand control over the export of exposure equipment and include Chinese GPU design startups on an Entity L...

2023-10-26

[News] Japanese Lawmaker Confirms Additional ¥900 Billion Subsidies for TSMC’s Kumamoto 2nd Fab

IC Manufacturing, Package&Test

According to a report by Bloomberg, Yoshihiro Seki, Secretary-General of the ruling Liberal Democratic Party and a member of the Japanese parliament, has announced that the government is planning to allocate an additional ¥900 billion for the construction of TSMC's Fab 2 in Kumamoto, Japan. Further...

2023-10-26

[News] UMC Foresees a Computer and Communication Market Rebound

IC Manufacturing, Package&Test

The semiconductor foundry, United Microelectronics Corporation (UMC), held an online briefing on October 25th to unveil its 3Q 2023 operational report. UMC achieved consolidated revenue of NT$57.07 billion, marking a 1.4% growth compared to the previous quarter's NT$56.3 billion in 3Q23. However, it...

2023-10-25

[News] SK hynix’s LPDDR5T Mobile DRAM Verified Compatible with Qualcomm for AI-Boosted Smartphone  

IC Manufacturing, Package&Test

SK hynix has introduced LPDDR5T (Low Power Double Data Rate 5 Turbo), a mobile DRAM with a remarkable 9.6Gbps speed. What sets this apart is its compatibility with Qualcomm’s new Snapdragon 8 Gen 3 Mobile Platform. LPDDR5T features a 16GB-capacity version, delivering data processing speeds of 7...

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