Subject


IC Manufacturing, Package&Test


2024-02-20

[News] AI Market: A Battleground for Tech Giants as Six Major Companies Develop AI Chips

IC Manufacturing, Package&Test

In 2023, "generative AI" was undeniably the hottest term in the tech industry. The launch of the generative application ChatGPT by OpenAI has sparked a frenzy in the market, prompting various tech giants to join the race. As per a report from TechNews, currently, NVIDIA dominates the market by...

2024-02-19

[News] CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers Expand to Seize Opportunities

IC Manufacturing, Package&Test

With the flourishing development of technologies such as AI, cloud computing, big data analytics, and mobile computing, modern society has an increasingly high demand for computing power. Moreover, with the advancement beyond 3 nanometers, wafer sizes have encountered scaling limitations and manu...

2024-02-01

[News] Intensified Competition in the Semiconductor Industry for 2nm Technology Dominance, Potentially Reshaping the Global Foundry Market

IC Manufacturing, Package&Test

The competition for dominance in 2nm semiconductor technology has intensified at the beginning of 2024, marking a crucial battleground among global foundry companies. As per a report from IJIWEI, major foundry enterprises such as Samsung Electronics, TSMC, and Intel are set to commence mass produ...

2024-01-23

[News] Subsidies from the U.S. Legislation “NAPMP” Potentially Expected to Cover IC Substrates

IC Manufacturing, Package&Test

The U.S. Department of Commerce has initiated the "National Advanced Packaging Manufacturing Program (NAPMP) ," with materials and substrates being the first subsidized areas. Due to the close collaboration between IC testing and IC substrates, it is not ruled out that the IC substrate industry coul...

2024-01-19

[News] Intel CEO Claims China’s Chip Manufacturing Lags Behind by 10 Years, Gap to Persist

IC Manufacturing, Package&Test

According to the report from TechNews, Intel CEO Pat Gelsinger, speaking at the World Economic Forum, stated that export sanctions from the United States, Japan, and the Netherlands are temporarily limiting China's development in semiconductor processes below 7 nanometers. Despite China's ongoing...

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