U.S. chip giant NVIDIA has reportedly updated its policy with memory suppliers, now requiring HBM stacks to be fully tested before being shipped to foundries for packaging, according to South Korean media outlet TheElec. The report indicates that HBM stacks from memory makers were previously sent...

According to TrendForce's latest memory spot price trend report, regarding DRAM, the upward momentum is concentrated on DDR5, while prices of DDR4 remains weak due to oversupply. As for NAND flash, demand rebounds post-Lunar New Year, with small-capacity MLC products seeing the largest demand as a r...

In the era of big data and AI, Compute Express Link (CXL) has emerged as the next-gen, high-speed standard, with memory giants eager to join the race. According to the bell, SK hynix is incorporating chiplet technology into its first in-house CXL controller, which will reportedly be manufactured by ...

As NVIDIA collaborates closely with memory heavyweights on their latest HBM products for AI accelerators, the U.S. chip giant is said to be in talks with Samsung and SK hynix to push the commercialization of a next-gen memory technology called SOCAMM (System on Chip Advanced Memory Module), accordi...

With HBM demand soaring, SK hynix is reportedly ramping up capacity expansion, as it accelerates progress at its M15X fab in Cheongju. According to NewDaily, the company will begin deploying engineers to prepare for operations at the site as soon as next month. SK hynix plans to finish building i...