According to TrendForce's latest memory spot price trend report, regarding DRAM, OEMs are gradually increasing inventory levels to ensure they have safe amounts of stock on hand before tariff policies become clearer, while DRAM suppliers have simultaneously raised spot prices of DRAM products by 8-1...

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...

Facing rising pressure from Chinese rivals, Samsung has reportedly told clients it will phase out production of 1z nm 8Gb LPDDR4, with the line reaching End of Life (EOL) in April, according to Commercial Times. As noted by Commercial Times, Samsung’s move has been in the pipeline for months, a...

As the U.S.-China chip war heats up, China is going all-in on AI ASICs, with Huawei’s flagship chips stealing the spotlight. But with rumors of the Ascend 920 entering mass production in 2H25, Commercial Times raises doubts about SMIC’s N+3 process and the chip’s access to top-tier HBM. Acc...

As leading memory giants ramp up preparations for the next-generation high bandwidth memory (HBM) battle, JEDEC—the standards-setting body for the microelectronics industry—has officially released the JESD270-4 HBM4 standard, a new memory standard designed to meet the surging demands of AI workl...