According to TrendForce's latest memory spot price trend report, regarding DRAM, the spot market shows prices of DDR4 products registering larger hikes compared with prices of DDR5 products due to the anticipation of supply tightening in the future. As for NAND flash, buyers have slowed down inquiri...

On May 14, Rambus announced the launch of a complete lineup of next-generation AI PC memory modules, specifically designed for client chipsets. This includes two new power management IC (PMIC) tailored for client-side computing: the PMIC5200 for LPDDR5 CAMM2 (LPCAMM2) memory modules and the PMIC5120...

While Samsung races full steam ahead with its 12hi HBM3e validation and HBM4 development, Micron stays under the radar. But according to New Daily, the U.S. memory giant is quietly gaining ground—its 12hi HBM3e yields are rapidly improving, earning rave reviews from major CSPs. Citing Micron’...

With new chip tariffs possibly around the corner, Washington may be gearing up for another strike on China’s semiconductor sector. According to Reuters, citing Financial Times, the U.S. Commerce Department is weighing whether to slap more Chinese tech firms—including DRAM giant CXMT—onto its e...

As China races to localize AI chips and memory, rumors are mounting that Washington may tighten controls on its HBM production. According to Chinese media outlet EE Times China, Hanmi Semiconductor has informed Chinese clients it will halt shipments of TC bonders, crucial tools for stacking HBM chip...