As memory giants gear up for the next-gen HBM battle, JEDEC has officially released the JESD270-4 HBM4 standard in mid-April. With AI models and HPC workloads demanding faster, larger memory, HBM4 is arriving just right on time. As per JEDEC’s press release, one of the major improvements in HBM...

With 1y and 1z nm 8Gb DDR4 production reportedly winding down, Samsung is said to be discontinuing its HBM2E products as well, as Commercial Times reveals they’ve reached the Last Buy Order (LBO) stage. Though Samsung declined to confirm the information, this could imply its shift to more high-...

SK hynix saw its Q1 operating profit surging 158% year-over-year, fueled by booming AI chip sales and stockpiling ahead of potential U.S. tariffs, as per Reuters. Despite the upbeat results, the South Korean memory giant warns that elevated macro uncertainties like tariff policy could lead to demand...

As the HBM race heats up, TC (thermal compression) bonders, which stack chips onto processed wafers by employing thermal compression to bond, are in hot demand. Memory giants are scrambling to lock in orders, and according to Money Today, Hanmi Semiconductor is seeing a surge in overseas interest, e...

According to Commercial Times, after reports that Samsung will halt 1y and 1z nm 8GB DDR4 production starting in April, Micron has also informed customers it will discontinue legacy DDR4 modules for servers. This shift reflects a broader industry trend, as memory makers accelerate product transiti...