Amid rumors of Google moving away from its HBM3E and NVIDIA’s looming test in June, Samsung looks set to turn the tide with its next-gen HBM. According to Korean Economic Daily and ZDNet, the company is in talks to supply customized HBM4 chips to major AI players, with shipments potentially starti...

Fudan University has achieved a key breakthrough in the field of integrated circuits. The research team led by Zhou Peng and Liu Chunsen has, by constructing a quasi-2D Poisson model, theoretically predicted a phenomenon called "super-injection," breaking through the existing theoretical limits of m...

According to TrendForce's latest memory spot price trend report, regarding DRAM, the three major DRAM suppliers have announced the impending end of production for DDR3 and DDR4 DRAM. This has triggered a rapid response in the spot market, with buyers busily stocking up on related memory products in ...

Amid rumors that Huawei is set to launch next-gen AI chips like the Ascend 910D and 920, the tech giant has reportedly teamed up with DeepSeek to integrate its Ascend series with DeepSeek’s budget-friendly AI models. According to TechNews, citing Chinese media outlet 53AI, an "all-in-one machine" ...

Amid growing tensions with its longtime TC bonder supplier Hanmi Semiconductor, SK hynix is reportedly taking things a step further. According to Financial News, the HBM leader has started reviewing a full diversification of all Hanmi-supplied equipment—not just TC bonders. While rumors suggest...