While Goldman Sachs expects HBM prices to decline next year as competition intensifies and pricing power shifts to major customers, the firm also notes that although GPUs will remain the main growth engine, ASICs are set to see even faster adoption in 2026. Building on this, Chosun Biz notes that th...

As NVIDIA and cloud giants like Meta and Google ramp up AI efforts, fueling HBM demand, analysts warn of a possible price dip next year. Citing Goldman Sachs, Economic Daily News reports that rising competition and oversupply could trigger the first HBM price drop in 2026—posing a challenge for ma...

SOCAMM, dubbed “the next HBM"  is beginning to gain traction in the market. According to ITHome, citing South Korean outlet ETNews, NVIDIA is expected to procure between 600,000 and 800,000 units of SOCAMM this year. Wccftech adds that demand is projected to accelerate further in 2026, driven by ...

According to TrendForce's latest memory spot price trend report, regarding DRAM, spot prices have eased slightly after earlier hikes, especially for DDR4 products, which had seen sharp increases. As for NAND flash, buying sentiment remains weak in the spot market, with prices for once-popular MLC eM...

According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...